The silicon has proven once again its capabilities and now it can be coiled around spheres and other shapes without losing its electric performance. This new silicon integrated circuit was developed by a team of researchers from the Materials Science and Engineering at the University of Illinois.

According to John Rogers, Founder Professor of MSE at the UI, their silicone integrated circuit can stretch, fold, bend and compress without any problem and as we said before, it doesn’t lose its electrical performances. This new silicon technology can provide devices that will monitor your health or it can be wrapped around aircraft wings.

This new study is a sequel of a project made by Prof. Rogers and his team that was finished in December 2005 consisting of a one-dimensional single-crystal silicon and now the extension of the silicon can go in two dimensions.

The researchers wanted to develop integrated circuits that can be applied to complex systems and they were helped by the wavy concept as Prof. Rogers says: “The wavy concept now incorporates optimized mechanical designs and diverse sets of materials, all integrated together in systems that involve spatially varying thicknesses and material types”.

These new silicon integrated circuits are high-performance and the developers claim that this technology “goes well beyond what planar configurations on semiconductor wafers can offer”.

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